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x ray orientation for single crystal silicon wafer and ingot

28-01-2024

x ray orientation for single crystal silicon wafer and ingot

x ray orientation for single crystal silicon wafer and ingot

  • for single crytal ingot/wafer

  • A,C,R,M plane

  • automatic orienation

  • quick plane detecting

  • data can be saved and output 


x ray orientation instrument

single crystal

YX-Z Automatic Peak-Searching

X-ray Orientation Instrument

 

Functions

X-ray automatic orientation instrument is a kind of accurate device which deigned integrates light, mechanical, electrical into one body according to X-ray diffraction principle, it can fast measure crystal direction of natural and artificial crystal(including piezoelectric, optic, laser, semiconductor), it can also use with cutter, grinder and other equipments. YX series X-ray orientation instrument is necessary device for precision process and manufacture crystal component, it can be used for orientation of all kinds of crystal and is broadly used in crystal material processing industry.

 

Features: 

1. PLC control technology is used. It is highly automated with low failure rate and high anti-inference capability and good system stability.

2. All Chinese human-computer interface,10-inch TFT touch panel, direct interface and easy for operation.

3. Automatic measurement by touch screen or foot switch.

4. It is accurate and convenient by automatic calibration, automatic scanning can be done for 10 times to get average value.

5. Meet different customers' requirements. Single-point,two-point and four-point measurement mode can be set.

6. It has measurement data printing function with USB data output interface.The data can be converted to Excel form and saved for management through the computer.   

7. The Modularized circuit design for easy maintenance and repair.

8. Automatic shutter control. The shutter is turned on only when necessary to provide operator with maximum protection.

9. Customize all kinds of work tables and sample fixtures according to different samples to ensure measurement accuracy and convenience of use.

10. Automatic measurement of wafer and ingot can be done. It is applied to angle test during every processing step to increase conformity rate of the product.

    

Technical Target

 

 (1) X-ray Generator

     Input PowerSingle Phase AC 220V50HZ0.5KW

     X-ray TubeCu Target Anode Grounding, Force Air Cooling

     Tube Voltage-30KVPSwitch closed under full voltage

     Tube Current0~5mAContinuous adjustable

     FrequencyTotal frequency not over 0.5KW

     ProtectionHV interlocktemperature protectionautomatic shutter                                                                               

     Statistic Inspection Accuracy≤±10″

    Use standard quartz plate SIO21011 surface)(θ13°20′)(26°40′

 (2) Angular Instrument

     Rotation angle of sample tableθ0~+50°;                              

     Rotation angle of reader0°~+100°;                                      

 (3) Touching Screen

    Minimum value of angle1″;                                 

   Digital displayDegreeMinuteSecond

    Angle adjustmentDigital displaying, can preset all angle value

 (4) Record            

    Counting tubeGJ5101Geiger tube, working voltage of 0~1100V .        

    Strength displayµA meter indicates crystal strength value.

 (5) Outer dimension 1150L×650W×1500H

 (6) WeightApproximately 200Kg

 

 


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